| 1. | Drivetrain systems vibration analysis - data requirements
动力传动系统振动分析.数据要求 |
| 2. | Engineering data requirements
工程数据的要求 |
| 3. | The ability to accommodate different data requirements and sources in the enterprise
容纳企业中不同的数据需求和数据源。 |
| 4. | Data requirements for semiconductor die . specific requirements and recommendations . thermal
半导体压模的数据要求.特殊要求和推荐标准.热性能 |
| 5. | Data requirements for semiconductor die . specific requirements and recommendations . test and quality
半导体压模的数据要求.特殊要求和推荐规程.试验和质量 |
| 6. | Data requirements for semiconductor die . exchange data formats and data dictionary . data dictionary
半导体模具的数据要求.交换数据格式和数据地址.数据地址 |
| 7. | Data requirements for semiconductor die . specific requirements and recommendations . electrical simulation
半导体压模的数据要求.特殊要求和推荐标准.电模拟 |
| 8. | Data requirements for semiconductor die . specific requirements and recommendations . handling and storage
半导体压模的数据要求.特殊要求和推荐规程.搬运和贮藏 |
| 9. | Data requirements for semiconductor die . particular requirements and recommendations for die types . bare die
半导体压模的数据要求.压模类型的特定要求和推荐标准.裸压模 |
| 10. | The objective of this stage is to specify in details the processing and data requirements of the option selected
这个阶段的目的是详细列明被取方案的程序及数据之需求。 |
